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Diamond Wire Triple-Station Single-Wire Cutting Machine

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July 21, 2025
Category Connection: Semiconductor Equipment
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#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the Diamond Wire Triple-Station Single-Wire Cutting Machine, designed for precision processing of SiC, sapphire, and silicon. This fully automated system features three independent workstations for rough cutting, precision finishing, and polishing, ensuring high-quality results for hard and brittle materials.
Related Product Features:
  • Fully automated precision machining system for hard and brittle materials.
  • Modular design with three independent workstations for multi-process machining.
  • High-rigidity gantry structure and nano-grade linear motor drive system.
  • Single diamond wire (0.1-0.3mm diameter) for sequential multi-process machining.
  • Suitable for special-shaped cutting, ultra-thin wafer processing, and low surface damage.
  • Supports semiconductor and optoelectronic materials like silicon, SiC, sapphire, and quartz.
  • Intelligent control system with PLC-based synchronization and machine vision positioning.
  • IoT data tracking for real-time monitoring of cutting force and temperature.
Faqs:
  • What are the benefits of the three-station diamond wire cutting machine?
    It combines rough cutting, precision finishing, and polishing in one system, reducing processing time by 40% and improving surface quality (Ra<0.2μm).
  • Which materials can be processed with this machine?
    Hard and brittle materials like SiC, sapphire, silicon, quartz, and ceramics with ±0.01mm precision.
  • What is the maximum workpiece size the machine can handle?
    The machine can handle workpieces up to 600*600mm in size.
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