The Diamond Wire Triple-Station Single-Wire Cutting Machine is a fully automated precision machining system specifically designed for processing highly complex hard and brittle materials. Featuring a modular design, it integrates three independent workstations for rough cutting, precision finishing, and polishing. Equipped with a high-rigidity gantry structure and nano-grade linear motor drive system (repeat positioning accuracy ±0.5μm), the machine utilizes a single diamond wire (diameter 0.1-0.3mm) to sequentially complete multi-process machining, enabling one-stop precision manufacturing from blank to finished product. It is particularly suitable for high-end process scenarios requiring special-shaped cutting, ultra-thin wafer processing, and low surface damage, comprehensively supporting precision machining needs for semiconductor and optoelectronic materials including silicon, silicon carbide (SiC), sapphire, and quartz.
Brief: Discover the Diamond Wire Triple-Station Single-Wire Cutting Machine, designed for precision processing of SiC, sapphire, and silicon. This fully automated system features three independent workstations for rough cutting, precision finishing, and polishing, ensuring high-quality results for hard and brittle materials.
Related Product Features:
Fully automated precision machining system for hard and brittle materials.
Modular design with three independent workstations for multi-process machining.
High-rigidity gantry structure and nano-grade linear motor drive system.
Single diamond wire (0.1-0.3mm diameter) for sequential multi-process machining.
Suitable for special-shaped cutting, ultra-thin wafer processing, and low surface damage.
Supports semiconductor and optoelectronic materials like silicon, SiC, sapphire, and quartz.
Intelligent control system with PLC-based synchronization and machine vision positioning.
IoT data tracking for real-time monitoring of cutting force and temperature.
Faqs:
What are the benefits of the three-station diamond wire cutting machine?
It combines rough cutting, precision finishing, and polishing in one system, reducing processing time by 40% and improving surface quality (Ra<0.2μm).
Which materials can be processed with this machine?
Hard and brittle materials like SiC, sapphire, silicon, quartz, and ceramics with ±0.01mm precision.
What is the maximum workpiece size the machine can handle?
The machine can handle workpieces up to 600*600mm in size.