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​​Multi-Function Multi-Wire Saw Machine

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September 05, 2025
Category Connection: Semiconductor Equipment
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#4 inch SiC ingot growing furnace #8 inch SiC ingot growing furnace #6 inch SiC ingot growing furnace
Brief: Discover the Multi-Function Multi-Wire Saw Machine, a cutting-edge solution for precision slicing of hard and brittle materials like sapphire, silicon, and quartz. With advanced servo-driven technology and stable tension control, it ensures high accuracy and efficiency for industrial applications.
Related Product Features:
  • Innovative cutting method with workpiece swinging down and stationary diamond wire for precision.
  • Fully servo-driven motor system with stable tension control for high operational accuracy.
  • Diamond wire speed up to 1000 m/min for cutting and 800 m/min for wiring/sharpening.
  • Broad cutting thickness range from 0.4 mm to 10 mm for versatile applications.
  • Closed-loop tension control to prevent wire breakage and ensure consistent performance.
  • Precision temperature control system for high slice accuracy and stable quality.
  • Simplified guide wheel design reduces consumables and energy loss.
  • Intelligent control system with remote monitoring and easy operation.
Faqs:
  • What materials can the Multi-Function Multi-Wire Saw Machine cut?
    It efficiently cuts hard and brittle materials like solar silicon wafers, sapphire, ceramics, quartz, and precious metals with high precision.
  • How does the multi-wire saw improve productivity compared to traditional methods?
    Its high-speed diamond wire (up to 1000m/min) and multi-blade cutting enable faster throughput and lower material waste compared to single-blade cutting.
  • What support services are available for this equipment?
    ZMSH offers customized solutions, comprehensive technical support, training, and after-sales maintenance including spare parts supply and hardware/software upgrades.
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