logo
SHANGHAI FAMOUS TRADE CO.,LTD
Home ProductsLab Wrapper

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

All Products
Gallium Nitride Wafer (35)
Sapphire Wafer (88)
SiC Substrate (132)
Sapphire Optical Windows (77)
IC Silicon Wafer (22)
Synthetic Sapphire Rod (13)
Fused Quartz Plate (40)
Sapphire Parts (114)
Synthetic Gemstone (72)
Semiconductor Equipment (55)
LiNbO3 Wafer (18)
GaAs Wafer (24)
Indium Phosphide Wafer (34)
Ceramic Substrate (25)
Lab Wrapper (31)
I'm Online Chat Now

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package
Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Large Image :  Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package

Product Details:
Place of Origin: CHINA
Brand Name: ZMSH
Certification: rohs
Model Number: Diamond-copper composite material
Payment & Shipping Terms:
Delivery Time: 2-4 weeks
Payment Terms: T/T
Contact Now
Detailed Product Description
Thermal Conductivity：: > 450 W /m K Density:: Only 5.6-6.8g/cm3
Surface Roughness:: Ra < 0.4 μm Application: Optical Communication Product Packaging
Highlight:

Diamond-copper Composite Material

,

0.4μm Diamond-copper Composite Material

Product Description

Diamond-copper composite material with high thermal conductivity COS series device package

Diamond copper composite material is composed of diamond and copper. It has the characteristics of high thermal conductivity and matching coefficient of thermal expansion with Si. It is very suitable for the packaging field of optoelectronic products with high thermal conductivity requirements, and can replace the currently widely used Cu/W, Al/SiC and other materials.

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package 0

Features

  • High thermal conductivity, thermal conductivity > 450 W/K
  • The thermal expansion number is well matched with Si, GaAs and GaN
  • The density is relatively small, only 5.6-6.8 g/CML 3
  • The surface is smooth and clean, and the surface roughness is < 0.4 μm
  • It can be adjusted according to the customer's needs to adjust the gold and rigid stone content to achieve different properties
  • The surface is easy to be plated with nickel and gold

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package 1Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package 2

Technical Parameters

Brand Diamond content Vol.% Thermal conductivity W/MK Coefficient of thermal expansion 10-6/K Flexural strength MPa
D40Cu60 40 450 7.5 300
D50Cu50 50 500 6.8 250
D60Cu40 60 600 6.0 200
 

 

 

Applications

1. Optical communication product packaging
2. COS tie piece sealing
3. T/R component packaging
4. Other heat sink

 

Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package 3Diamond-copper Composite Material With High Thermal Conductivity COS Series Device Package 4

Our services

1. Factory direct manufacture and sell.

2. Fast, accurate quotes.

3. Reply to you within 24 working hours.

4. ODM: Customized design is avaliable.

5. Speed and precious delivery.

FAQ

1. Q: How to pay?
     A:100％T/T, Paypal, West Union, MoneyGram, Secure payment and Trade
         Assurance on and etc..

2. Q: What's the delivery time?
     A: (1) For the standard products
    For inventory: the delivery is 5 workdays after you place the order.
    For customized products: the delivery is 2 or 3 weeks after you place the order.
         (2) For the special-shaped products, the delivery is 4 workweeks after you place the order.

3. Q: Can I customize the products based on my need?
     A: Yes, we can customize the material, specifications for your optical components
         based on your needs.

Tag:

Single Tray Sapphire Parts,

2inch Sapphire Wafer,

Sapphire Wafer Single Packaging

Contact Details
SHANGHAI FAMOUS TRADE CO.,LTD

Contact Person: Mr. Wang

Tel: +8615801942596

Send your inquiry directly to us (0 / 3000)

SiC Substrate

High Purity un-doped Silicon Carbide sic Wafer , 6Inch 4H-Semi Sic Silicon Carbide Substrate

2 Inch 6H - Semi Silicon Carbide Wafer Low Power Consumption For Detector

4inch Sic Ingot Silicon Carbide 5 - 15mm Thickness for semiconductors

4H-SEMI Polished Sic Wafer lens 2INCH 3INCH 4INCH 9.0 Hardness For Device Material

Sapphire Wafer

Semiconductor Wafer Custom Sapphire Glass / Sapphire Windows Special Orientation

sapphire wafer Thickness 0.43mm Sapphire Components Customized Size And Orientations

Square Sapphire Wafer / Sapphire Crystal Glass 10x10mm 5x5mm For Optical Lens

2°Off C - Axis Synthetic Sapphire Glass Epi - Ready Substrates 2 Inch Diameter 50.8mm

Gallium Nitride Wafer

Laser Projection Display Gallium Nitride GaN Wafer 350um Thickness

2inch 4inch free-standing GaN Gallium Nitride Substrates Template for led

2INCH 4INCH NPSS/FSS AlN template on sapphire EPI-wafer AlN-On-Sapphire wafer

2inch 4Inch Gallium Nitride GaN AlN Template Wafer On Sapphire,Si Substrates

Request A Quote

E-Mail | Sitemap

Mobile Site
Privacy Policy | China Good Quality Gallium Nitride Wafer Supplier. © 2018 - 2025 SHANGHAI FAMOUS TRADE CO.,LTD. All Rights Reserved.