Diamond Wire Single / Multiple Wire Saw Machine For Semiconductor Wafer Processing

Typical applications of diamond wire single/multiple wire saw machine

1. Semiconductor Wafer Manufacturing:

• Precision cutting of SiC/GaN power device wafers for EV and 5G infrastructure
• High-quality processing of sapphire substrates for LED and consumer electronics
• MEMS sensor chip dicing ensuring device performance and reliability

2. Photovoltaic Production:

• High-efficiency slicing of large monocrystalline silicon ingots
• Precision processing of heterojunction solar cells
• Stable cutting of ultra-thin silicon wafers (<120μm)

3. Optical Component Processing:

• Precision forming of quartz glass optical elements
• Accurate cutting of laser crystals (YAG, sapphire, etc.)
• Infrared optical window processing

4. Special Material Processing:

• Precision machining of AlN/Al₂O₃ ceramic substrates
• Cutting of silicon carbide composites
• Processing of ultra-hard materials (CVD diamond)

5. Research & Special Applications:

• Prototyping of novel semiconductor materials
• Development of micro-devices and special structures
• Custom-shaped sample preparation

Technical advantages of diamond wire single/multiple wire saw machine

• Stable processing quality with >99.5% yield rate
• Adaptable to various hard/brittle materials
• Significantly higher productivity than conventional methods
• Easy operation and maintenance with low TCO

Note: Custom solutions available including special dimension processing and cleanroom versions.

FAQ of diamond wire single/multiple wire saw machine

1. Q: What is the main advantage of a dual-station diamond wire saw?
    A: It enables simultaneous high-precision single-wire cutting and multi-wire batch processing, boosting productivity by 50% compared to single-mode machines.

2. Q: Which materials can be cut with diamond wire dual-station saws?
    A: Hard/brittle materials like silicon, SiC, GaN, sapphire, quartz, and ceramics with precision up to ±0.01mm.

Tags: #Diamond Wire Single/Multiple Wire Saw Machine, #Semiconductor Wafer Processing