Product Details:
Payment & Shipping Terms:
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Product Name: | InP Substrates | Bow & Warp: | ≤10μm |
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Material: | Indium Phosphide Wafer | Orientation: | 100+/-0.05 Degree |
Surface Finish: | Double Side Polished | Surface Roughness: | Ra≤0.6nm |
TTV: | ≤6μm | Wafer Diameter: | 2 Inch 3inch 4inch |
Wafer Thickness: | 350um 500um 625um | ||
Highlight: | Double Side Polished Inp Wafer,4'' Thickness Indium Phosphide Wafer,InP Semiconductor Substrates |
Indium Phosphide Wafer InP Semiconductor Substrates Epitaxial 2'' 3'' Thickness 350um
Description of Indium Phosphide:
Indium Phosphide (InP) chips are a widely used material in optoelectronics and semiconductor devices. It has the following advantages:
Features of Indium Phosphide:
Indium Phosphide (InP) chips have some remarkable characteristics that make them widely used in optoelectronics and semiconductors. The following are some of the main characteristics of indium phosphide chip materials:
Technical Parameters of Indium Phosphide:
Item |
Parameter |
UOM |
Material |
InP |
|
Conduction type/Dopant |
S-C-N/S |
|
Grade |
Dummy |
|
Diameter |
100.0+/-0.3 |
mm |
Orientation |
(100) +/-0.5° |
|
Lamellar twin area |
useful single crystal area with (100) orienation > 80% |
|
Primary Flat Orientation |
EJ(0-1-1) |
mm |
Primary Flat Length |
32.5+/-1 |
|
Secondary Flat Orientation |
EJ(0-11) |
|
Secondary Flat Length |
18+/-1 |
|
Applications of Indium Phosphide:
Indium Phosphide (InP) wafers have a wide range of applications in optoelectronics and semiconductor substrates:
FAQ:
Q1: What brand name is the InP wafer?
A1: The InP wafer is made by ZMSH.
Q2: What's the diameter of the InP wafer?
A2: The diameter of InP wafer is 2'', 3'', 4''.
Q3: Where is the InP wafer from?
A3: The InP wafer is from China.
Q4: Is the InP wafer ROHS certified?
A4: Yes, the InP wafer is ROHS certified.
Q5: How many InP wafes can I buy at 1 time?
A5: The minimum order quantity of the InP wafer is 5pcs.
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Contact Person: Mr. Wang
Tel: +8615801942596