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Customized SiC Ceramic Boat Carrier For Wafer Handling

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Customized SiC Ceramic Boat Carrier For Wafer Handling

Customized SiC Ceramic Boat Carrier For Wafer Handling
Customized SiC Ceramic Boat Carrier For Wafer Handling Customized SiC Ceramic Boat Carrier For Wafer Handling Customized SiC Ceramic Boat Carrier For Wafer Handling Customized SiC Ceramic Boat Carrier For Wafer Handling

Large Image :  Customized SiC Ceramic Boat Carrier For Wafer Handling

Product Details:
Place of Origin: China
Brand Name: zmsh
Certification: rohs
Detailed Product Description
Material: SiC Ceramic Size: 50mm X 30mm Costumized Avalible
Highlight:

Wafer Handling Ceramic Boat carrier

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Customized Ceramic Boat carrier

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SiC Ceramic Boat carrier

Customized SiC Ceramic Boat Carrier for Wafer Handling

 
The Customized Silicon Carbide (SiC) Ceramic Boat Carrier is a high-performance wafer handling solution designed for semiconductor, photovoltaic, and LED manufacturing processes. Engineered for high-temperature stability, chemical resistance, and ultra-low contamination, this carrier ensures safe and efficient wafer transport in demanding environments such as CVD, diffusion furnaces, and oxidation chambers.
 

 

Customized SiC Ceramic Boat Carrier For Wafer Handling 0Customized SiC Ceramic Boat Carrier For Wafer Handling 1
 
 


 

Key Advantages of SiC Ceramic Boat

 

 
High Thermal Stability – Withstands temperatures up to 1,600°Cwithout deformation.
Chemical Inertness – Resists acids, alkalis, and plasma erosion, ensuring long-term durability.
Low Particle Generation – Minimizes contamination in EUV and advanced node fabrication.
Customizable Design – Tailored for wafer size, slot pitch, and handling requirements
Ideal for semiconductor fabs, MEMS production, and compound semiconductor processing
 
 

 

Customized SiC Ceramic Boat Carrier For Wafer Handling 2Customized SiC Ceramic Boat Carrier For Wafer Handling 3
 
 


 

Specification

 

 

Silicon Carbide Content-%>99.5
Average Grain Size-micron4-10
Bulk Density-kg/dm^3>3.14
Apparent Porosity-Vol %<0.5
Vickers HardnessHV0.5Kg/mm^22800
Modulus of Rupture (3 points)20°CMPa450
Compression Strength20°CMPa3900
Modulus of Elasticity20°CGPa420
Fracture Toughness-MPa/m^1/23.5
Thermal Conductivity20°CW(m*K)160
Electrical Resistivity20°COhm.cm10^6-10^8
Coefficient of Thermal Expansiona
(RT"800°C)
K^-1*10^-64.3
Max. Application TemperatureOxide Atmosphere°C1600
Max. Application TemperatureInert Atmosphere°C1950
 

 


 

 

Applications of SiC Ceramic Boat 

 

 
1. Semiconductor Manufacturing
✔ Diffusion & Annealing Furnaces
- High-Temperature Stability – Withstands 1,600°C (oxidizing) / 1,950°C (inert) without deformation.
- Low Thermal Expansion (4.3×10⁻⁶/K) – Prevents wafer warpage in rapid thermal processing (RTP).

✔ CVD & Epitaxy (SiC/GaN Growth)
- Gas Corrosion Resistance – Inert to SiH₄, NH₃, HCl, and other aggressive precursors.
- Particle-Free Surface – Polished (Ra <0.2μm) for defect-free epitaxial deposition.

✔ Ion Implantation
- Radiation-Hardened – No degradation under high-energy ion bombardment.

 
 
2. Power Electronics (SiC/GaN Devices)
✔ SiC Wafer Processing
- CTE Matching (4.3×10⁻⁶/K) – Minimizes stress in 1,500°C+ epitaxial growth.
- High Thermal Conductivity (160 W/m·K) – Ensures uniform wafer heating.

✔ GaN-on-SiC Devices
- Non-Contaminating – No metal ion release vs. graphite boats.

 
 
3. Photovoltaic (Solar Cell) Production
✔ PERC & TOPCon Solar Cells
- POCl₃ Diffusion Resistance – Withstands phosphorus doping environments.
- Long Service Life – 5-10 years vs. 1-2 years for quartz boats.

✔ Thin-Film Solar (CIGS/CdTe)
- Corrosion Resistance – Stable in H₂Se, CdS deposition processes.

 
 
4. LED & Optoelectronics
✔ Mini/Micro-LED Epitaxy
- Precision Slot Design – Holds fragile 2"–6" wafers without edge chipping.
- Cleanroom-Compatible – Meets SEMI F57 particle standards.

 
 
5. Research & Specialty Applications
✔ High-Temp Material Synthesis
- Sintering Aids (e.g., B₄C, AlN) – Chemically inert in 2,000°C+ environments.
- Crystal Growth (e.g., Al₂O₃, ZnSe) – Non-reactive with molten materials.

 


 

FAQ

 
Q1: What wafer sizes are supported?
Standard: 150mm (6"), 200mm (8"), 300mm (12"). Customization available upon request.
 
Q2: What is the lead time for customized designs?
- Standard models: 4–6 weeks.
- Fully customized: 8–12 weeks (depending on complexity).

 

Contact Details
SHANGHAI FAMOUS TRADE CO.,LTD

Contact Person: Mr. Wang

Tel: +8615801942596

Send your inquiry directly to us (0 / 3000)