Diamond Wire Triple-Station Single-Wire Cutting Machine for SiC/Sapphire/Silicon Processing
The Diamond Wire Triple-Station Single-Wire Cutting Machine is a fully automated precision machining system specifically designed for processing highly complex hard and brittle materials. Featuring a modular design, it integrates three independent workstations for rough cutting, precision finishing, and polishing. Equipped with a high-rigidity gantry structure and nano-grade linear motor drive system (repeat positioning accuracy ±0.5μm), the machine utilizes a single diamond wire (diameter 0.1-0.3mm) to sequentially complete multi-process machining, enabling one-stop precision manufacturing from blank to finished product. It is particularly suitable for high-end process scenarios requiring special-shaped cutting, ultra-thin wafer processing, and low surface damage, comprehensively supporting precision machining needs for semiconductor and optoelectronic materials including silicon, silicon carbide (SiC), sapphire, and quartz.
Diamond Wire Triple-Station Single-Wire Cutting Machine Technical Specifications
| Model |
Three station diamond single line cutting machine |
| Maximum workpiece size |
600*600mm |
| Wire running speed |
1000 (MIX) m/min |
| Diamond wire diameter |
0.25-0.48mm |
| Line storage capacity of supply wheel |
20km |
| Cutting thickness range |
0-600mm |
| Cutting accuracy |
0.01mm |
| Vertical lifting stroke of workstation |
800mm |
| Cutting method |
The material is stationary, and the diamond wire sways and descends |
| Cutting feed speed |
0.01-10mm/min (According to the material and thickness) |
| Water tank |
150L |
| Cutting fluid |
Anti rust high-efficiency cutting fluid |
| Swing angle |
±10° |
| Swing speed |
25°/s |
| Maximum cutting tension |
88.0N (Set minimum unit0.1n) |
| Cutting depth |
200~600mm |
| Make corresponding connecting plates according to the customer's cutting range |
- |
| Workstation |
3 |
| Power supply |
Three phase five wire AC380V/50Hz |
| Total power of machine tool |
≤32kw |
| Main motor |
1*2kw |
| Wiring motor |
1*2kw |
| Workbench swing motor |
0.4*6kw |
| Tension control motor |
4.4*2kw |
| Wire release and collection motor |
5.5*2kw |
| External dimensions (excluding rocker arm box) |
4859*2190*2184mm |
| External dimensions (including rocker arm box) |
4859*2190*2184mm |
| Machine weight |
3600ka |
Diamond Wire Triple-Station Single-Wire Cutting Machine Working Principle
1. Three-Station Collaborative Operation:
- Station A (Rough Cutting): High-speed cutting (1-2m/s) for rapid shaping, leaving 0.05mm allowance.
- Station B (Precision Finishing): Low-speed precision trimming (0.5m/s) with accuracy up to ±0.01mm.
- Station C (Polishing): Chemical mechanical polishing (CMP) or laser treatment achieves surface roughness Ra<0.2μm.
2. Intelligent Control System:
- PLC-based synchronization ensures seamless process transitions.
- Machine vision positioning (5μm accuracy) automatically calibrates cutting paths.
Diamond Wire Triple-Station Single-Wire Cutting Machine Features and Compatible Materials
|
Feature
|
Description
|
Material Characteristics
|
|
Three-Process Integration
|
Reduces workpiece handling, lowering contamination rate by 90%
|
Silicon (ultra-thin wafers <50μm), SiC (high hardness)
|
|
High-Precision Special-Shaped Cutting
|
Supports complex shapes (arcs/bevels) with profile accuracy ±0.02mm
|
Sapphire (optical grade), quartz (low thermal expansion)
|
|
Adaptive Tension Control
|
Real-time wire tension adjustment (20-50N) prevents breakage
|
Ceramics (AlN/Al₂O₃), composite substrates
|
|
Multi-Material Compatibility
|
Quick parameter switching for different materials
|
Special crystals (LiNbO₃), CVD diamond
|
Diamond Wire Triple-Station Single-Wire Cutting Machine Technical Advantages
- Efficiency: Three-station continuous processing reduces cycle time by 40%.
- Quality: Polishing station achieves surface damage layer <10nm, improving device performance by 20%.
- Flexibility: Independent station operation adapts to R&D and small-batch needs.
- Intelligence: IoT data tracking with real-time monitoring of cutting force and temperature.
Diamond Wire Triple-Station Single-Wire Cutting Machine core application areas
1. Semiconductor Power Device Manufacturing:
- SiC MOSFET Trench Processing: Three-station collaboration first rough-cuts trench profiles, then precision-finishes sidewalls (±0.1° angle tolerance), and finally polishes to achieve trench surface roughness Ra<10nm, significantly enhancing switching performance.
- Ultra-Thin IGBT Wafer Dicing: For silicon wafers <50μm thick, "descending + oscillating" composite cutting technology controls chipping to <5μm with >99.8% yield.
2. Consumer Electronics Optical Components:
- 3D Curved Sapphire Cover Processing: Rough-cuts basic contours, precision-finishes curved surfaces (radius R0.5mm±0.01mm), and polishes to achieve >93% transmittance for smartphone camera modules and smartwatch screens.
- Micro-Prism Array Fabrication: Processes micron-level prism structures (50-200μm depth) on quartz glass, ensuring array pitch error <1μm.
3. Advanced Research & Special Engineering:
- Fusion Device Window Material Processing: Special-shaped cutting of CVD diamond (0.3-1mm thickness) avoids graphitization, maintaining thermal conductivity >2000W/m·K.
- Aerospace Ceramic Thermal Protection Components: Microchannel cutting (0.1mm width/1mm depth) on AlN substrates achieves channel wall roughness Ra<0.1μm, reducing fluid resistance.
Diamond Wire Triple-Station Single-Wire Cutting Machine FAQ
1. Q: What are the benefits of 3-station diamond wire cutting?
A: It combines rough cutting, precision finishing, and polishing in one system, reducing processing time by 40% and improving surface quality (Ra<0.2μm).
2. Q: Which materials can be processed with this machine?
A: Hard/brittle materials like SiC, sapphire, silicon, quartz, and ceramics with ±0.01mm precision.
Tags: #Diamond Wire Triple-Station Single-Wire Cutting Machine, #SiC/Sapphire/Silicon Processing
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