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Product Details:
Payment & Shipping Terms:
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Vertical Lifting Stroke Of Workbench: | 250mm | Wire Running Speed: | 1200(max),2000(max),m/min,optional |
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Diamond Wire Diameter: | 0.10 - 0.5mm | Cutting Thickness Range: | 0.6 - 10mm |
Swing Angle: | ±8° | Applications: | Magnetic Material Processing, Semiconductor And Electronic Materials |
Inverted Multi-Wire Saw Machine for High-Precision Diamond Wire Cutting
The inverted ultra-precision multi-wire saw is a high-speed model within our company's multi-wire saw product line, specifically designed for the efficient batch processing of various hard and brittle materials. This model features an innovative inverted structural design and is equipped with a streamlined wire guide system (typically optimized to 6 guide wheels). This design enhances processing efficiency while significantly improving operational stability and process adaptability.
Its core cutting principle utilizes high-speed reciprocating diamond wires (embedded with diamond particles) to grind-cut hard and brittle materials in the processing area. By precisely controlling cutting parameters, it can produce uniform-thickness, high-quality thin slices. This equipment perfectly balances high production efficiency, excellent product quality, low processing costs, high control precision, and environmental friendliness, making it particularly suitable for customers with high requirements for cost control and material utilization. Additionally, the device adopts a modular design for convenient waste recycling, aligning with the sustainable development requirements of modern manufacturing.
The working principle of the inverted multi-wire saw is based on high-speed reciprocating diamond wires carrying diamond particles to grind-cut hard and brittle materials. The detailed process is as follows:
1. Wire Mesh Formation
2. High-Speed Reciprocating Cutting
3. Precision Feed Control
4. Intelligent Tension Control
5. Closed-Loop Cooling System
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1. Modern Industrial Design |
• Sleek and Modern Aesthetics: The product features a clean, modern design language with multiple color options to meet diverse customer preferences.
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2. User - Friendly Operational Design |
• Automated Shield Lifting: The protective shield can be automatically adjusted up or down, balancing operational safety with ease of observation and adjustment.
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3. Optimized Structural Layout |
• Functional Zoning: The machine is divided into functional areas, with the main cutting zone separated from the wire pay - off/take - up operation area to minimize interference and provide a stable environment for the wire system.
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4. Streamlined and Efficient Guide System |
• Reduced Guide Wheels: The number of guide wheels is optimized to 6 (compared to 8 - 10 in traditional models), significantly reducing consumable usage, energy consumption, and operational costs while minimizing potential failure points.
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5. High - Precision Drive System |
• Imported Precision Components: Key drive components, including the main spindle and bearing housing, utilize imported high - precision parts to ensure machining accuracy and long - term stability.
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6. Quiet and Eco - Friendly Design |
• Low Operational Noise: The equipment operates at noise levels typically below 75 decibels, safeguarding operator hearing health and creating a more comfortable working environment.
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7. Full Servo Drive Control |
• Precision Servo Motors: Critical functions — wire pay - off, take - up, wire threading, spindle rotation, wire tension, and worktable feeding — are powered and controlled by high - precision servo motors, ensuring precise synchronization and coordination of all moving parts.
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8. Intelligent Tension Management System |
• Closed - Loop Tension Control: The wire pay - off and take - up tension control utilizes a closed - loop feedback mechanism to monitor and automatically adjust wire tension, maintaining consistency throughout the cutting process for enhanced quality and stability.
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1. Magnetic Material Processing
2. Semiconductor and Electronic Materials
3. Optical and Precision Ceramic Materials
4. New Energy Materials
5. Scientific Research and Special Materials
1. Q: What materials are suitable for cutting with an inverted multi-wire saw?
A: Commonly used for cutting hard and brittle materials such as silicon wafers, sapphire, and ceramics.
2. Q: What are the advantages of an inverted multi-wire saw compared to traditional cutting machines?
A: It offers higher cutting precision, faster efficiency, and lower material waste.
Tags: #Inverted Multi-Wire Saw Machine, #Custom, #High-Precision Diamond Wire Cutting
Contact Person: Mr. Wang
Tel: +8615801942596