The Laser Lift-Off (LLO) System is an advanced precision processing technology that utilizes high-energy pulsed lasers to achieve selective material separation at interfaces. This technology is widely applied in semiconductor manufacturing, flexible electronics, optoelectronic devices, and energy sectors. Its core advantages include non-contact processing, high-resolution control, and multi-material compatibility, making it indispensable for applications such as MicroLED mass transfer, flexible display fabrication, and semiconductor wafer-level packaging.